Home         Authors   Papers   Year of conference   Themes   Organizations        To MES conference

Themes

Listing of works with the partition by the subject of reports. Click on the work title to see its details. The selected set may be restricted by specifying a range of conference years, or by selecting a specific topic.

Select: from to year
 
All topics

ADC design problems
Cellular automata
Design of System-on-chip (SoC) and IP-blocks
Design of VLSI elements
Design of VLSI signal processors
Design of analog and mixed functional blocks of VLSI
Design of digital functional blocks of VLSI
Design of fault-tolerance systems
Design of micro-electromechanical systems
Design of nanoelectronic devices
Design of nanoelectronic devices based on Josephson junctions
Design of photodetecting VLSI
Design of radiation-resistant VLSI
Design of technological processes
Designing components for aerospace and navigation technology
Genetic algorithms in VLSI CAD
Methods and algorithms for automated layout design
Methods for high-level simulation
Methods of device technology simulation of VLSI
Methods of digital information processing and digital filters
Methods of electro-thermal simulation
Methods of logic synthesis and functional logic simulation ...
Methods of simulation of VLSI electrical characteristics
Models of devices for circuit simulation
Neural networks
Problems of development of sensory microcircuitry
Simulation of data transfer channels
Study of the magnetic properties of materials
Unconventional computing systems
Web-based VLSI CAD
design of memory cells
Selection on topic: Methods of electro-thermal simulation
Selected papers: from 2005 to 2024 year
In selection - 31 papers
A C D E H I M N P R S T
A 
 
Accuracy and adequacy of the analytical modeling of the temperature distribution in thermal microsystems
A method for reducing timing delay temperature dependence of digital integrated circuits
An improved procedure for electro-thermal simulation of the characteristics of Bi-CMOS-DMOS IC output stages
Autonomous parameters of of transistors of uncommited logic array ABMK_1_3 in radiation and temperature influences
C 
 
Ceramics-based device of touch and contactless information input for avionics
Comparative analysis of the memory elements and sense amplifiers for high-temperature VLSI RAM
Comparison of MOSFET and FinFET thermal characteristics
D 
 
Design of digital CMOS circuits for extreme temperatures
Digital circuit IBIS-models generation with account for temperature and radiation
E 
 
Electro-Thermal Simulation of Multi-channel Power Devices: From Workbench to Simplorer by means of Model Reduction
Electro-thermal Simulation of a Bandgap
Electro-thermal modes simulation for PCB and IC in industrial class EDA environment
Electro-thermal simulation process implementation in Mentor Graphics IC Station
Enhancing subsystem for thermal simulation of PCB in Mentor Graphics EDA
Expansion of SPICE Simulation Tools Abilities by Taking into Account MOS Circuits Aging Effects Caused by Hot Carriers, Gate Dielectric Breakdown and Electromigration
H 
 
High-Voltage Silicon Diode Simulation, the Dependences of Its Current Density from Temperature Construction
I 
 
Increase of uniformity of distribution of a thermal field at initial placement of topological IC cells
Investigation of CMOS Multiplexor SEL Sensitivity at Low Temperature
M 
 
Mathematical modelling of temperature distribution in thermal microsensors
Membrane-based thermal flow sensor working on calorimetric principle
Modeling of heat flux distribution in microwave monolithic ICs based on gallium nitride-HEMT transistors
N 
 
Numerical model of semiconductors with crystal heating
P 
 
Placement of Logic Cells of Integrated Circuits with Simultaneous Consideration of Performance and Thermal Mode
R 
 
Research of electric and temperature area of safe work of planar power SoC MOS transistors
S 
 
Simulation of SEU failures in submicronic SoS CMOS cells of memory in view of temperature effects
Simulation of unsteady modes of thermal microsensors
T 
 
Temperature sensors modeling for smart power ICs
The analysis of operability łą submicronic RAM CMOS VLSI at extreme thermal modes
Thermal simulation of MES components: from submicronic VLSI elements up to complex electronic blocks
Thermo Researching of X-band Microwave Amplifier
Thermoelement Linear Dimensions Influence on Output Characteristics of Thermoelectric Generator

Copyright © 2009-2024 IPPM RAS. All Rights Reserved.

Design of site: IPPM RAS