| Thermal simulation of MES components: from submicronic VLSI elements up to complex electronic blocks |
|
|
| Authors |
| | Petrosyants K.O. |
| Date of publication |
| | 2008 |
|
| Abstract |
| | The multilevel subsystem of thermal simulation of separate semi-conductor devices and IC components, monolithic and hybrid IC, hybrid micro-assembly, multilayered printed-circuit-boards, constructive blocks is considered. |
| Keywords |
| | Thermal simulation of MES components |
| Library reference |
| | Petrosyants K.O. Thermal simulation of MES components: from submicronic VLSI elements up to complex electronic blocks // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2008. Proceedings / edited by A. Stempkovsky, Moscow, IPPM RAS, 2008. P. 239-242. |
| URL of paper |
| | http://www.mes-conference.ru/data/year2008/42.pdf |
