| Design of IC package with ceramic substrate for multicore processor |
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| Authors |
| | Bychkov I.N. |
| Date of publication |
| | 2014 |
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| Abstract |
| | This paper proposes new technologies for IC package of multicore processor.
This technologies were selected for original multicore processor from "Elbrus" product line.
Technology aware and effective design solutions are considered for IC package with ceramic substrate. |
| Keywords |
| | chip consruction, Low Temperature Cofired Ceramic (LTCC), ball matrix, signal assignment, package substrate design |
| Library reference |
| | Bychkov I.N. Design of IC package with ceramic substrate for multicore processor // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2014. Proceedings / edited by A. Stempkovsky, Moscow, IPPM RAS, 2014. Part 2. P. 163-166. |
| URL of paper |
| | http://www.mes-conference.ru/data/year2014/pdf/D168.pdf |
