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Disadvantages of domestic analytical-experimental methods prediction of reliability of the integrated circuits
Authors
	Solovev A.V.
	Seletskiy A.V.
Date of publication
	2020
DOI
	10.31114/2078-7707-2020-1-76-81
Abstract
	Prediction of the electronic products reliability is a mandatory procedure performed at the development stage. Failure Rate (λ) and Mean time between failures (MTBF) is the main indicators of reliability. Nowadays, in the Russian Federation using three domestic methods for calculating reliability. The first two are the manuals “Reliability of electronic products” and “Reliability of electronic products of foreign manufacture”, the third is the guiding document RD 11 0755-90. Sometimes also using some of foreign standards - MIL HDBK 217F, RIAC-HDBK-217Plus, IEC TR 62380, FIDES guide 2009 Edition A. The most modern standards are RIAC-HDBK-217Plus and FIDES, while MIL HDBK 217F and RD 11 0755 -90 hasn't been updated since the 90s of the last centuries. However, for Russian military microcircuits, using foreign standards is undesirable. The reliability of modern ICs is quite high and is estimated by the failure rate around λ = 100 ... 1 FIT. The site of the company "XILINX" provides data on the reliability of IP, made by various technologies. For example, the failure rate for the 0.18-micron technology is 11-14 FIT, and for the 0.09-micron technology it is 2-3 FIT. Using MIL-HDBK-217F standard when calculating the basic values of the failure rate of the package and welded joints improves the values of the failure rate during operation and brings the estimated values closer to real data. The failure rate of the structural elements of the integrated circuit is 59 FIT, which is 3 times better than the value obtained using the approximation of the data of RD 11 0755-90. The total failure rate of the IS is 67 FIT. Using the FIDES guide 2009 Edition A standard also improves prediction of the reliability, however, it may require adjusting the initial formulas of the RD 11 0755-90 methodology. Has been considered two methods of using the values of the FIDES guide 2009 Edition A standard for calculating the failure rate according to RD 11 0755-90 - using the basic values for the package and welded joints in the calculation of the structural component of λIS and calculation of the structural component of the failure rate only using data from the FIDES standard. In the first case, the structural component is λ1 = 9.8 FIT, and in the second case, λ1 = 0.32 FIT. The method used in RD 11 0755-90 operates with a large number of parameters in comparison with other domestic directories, which allows a more accurate estimate of the failure rate of ICs by the calculation and experimental method. However, many data require updating and adjustment. One of the ways to increasing the accuracy of reliability assessment can be to using basic values from foreign standards of reliability.
Keywords
	integrated circuit reliability, Failure Rate, Mean time between failures, MTBF, ÐÄ 11 0755-90, MIL-HDBK-217F, FIDES.
Library reference
	Solovev A.V., Seletskiy A.V. Disadvantages of domestic analytical-experimental methods prediction of reliability of the integrated circuits // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2020. Issue 1. P. 76-81. doi:10.31114/2078-7707-2020-1-76-81
URL of paper
	http://www.mes-conference.ru/data/year2020/pdf/D044.pdf