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The Single Event Upset Forecasting in Digital and Analog Integrated Circuits in SAED 14nm FinFet Technology  

Authors
 Melikyan V.Sh.
 Petrosyan A.
 Mkhitaryan A.Kh.
 Hayrapetyan A.K.
 Avetisyan Z.
 Mkrtchyan A.E.
Date of publication
 2018
DOI
 10.31114/2078-7707-2018-4-76-81

Abstract
 This paper presents a verification method of the Single Event Upset effect on the performance of bandgap reference circuit designed in SAED 14nm FinFet technology. Meanwhile the EDA tool was suggested which automatically inserts the radiation effect in the SPICE netlist and generates new netlist for further debug. The tool can automatically run a SPICE simulation and generate plot files in SPICE output formats. The suggested user-friendly GUI helps the designer to realize the measurements and organize the faster debug.
Keywords
 SAED 14nm FinFet; radiation; bandgap reference; parametric degradation; single event upset; SPICE Compatible Single Event Upset Debugger; positive to absolute temperature; negative to absolute temperature; incident particle; voltage overshoot.
Library reference
 Melikyan V.Sh., Petrosyan A., Mkhitaryan A.Kh., Hayrapetyan A.K., Avetisyan Z., Mkrtchyan A.E. The Single Event Upset Forecasting in Digital and Analog Integrated Circuits in SAED 14nm FinFet Technology // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2018. Issue 4. P. 76-81. doi:10.31114/2078-7707-2018-4-76-81
URL of paper
 http://www.mes-conference.ru/data/year2018/pdf/D133.pdf

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