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Technometric Identification of Integrated Circuits for Controlling Life Cycle and Counterfeit Detection  

Authors
 Semenov A.V.
 Starcev V.N.
 Stepanov E.N.
Date of publication
 2018
DOI
 10.31114/2078-7707-2018-4-143-148

Abstract
 we considered the possibility of controlling and identifying chips and other electronic products. In particular, we propose approach of identification based on measurements of analog characteristics of the product considered as a "black box". For the build system used by the instrument of biometrics and physically uncloneable functions. We get a set of properties that an identification system should possess so, than we can talk about the technometry of integrated circuits. By analogy with biometrics, the set of characteristics shall contain the following information: versatility (each typical object must have a measurable characteristic), uniqueness (how well one object separates from the other in terms of the distinction algorithm used), constancy (selected features remain unchanged over time). In relation to our approach, the classical biometric problem takes the following form: technometric verification (search for counterfeit, which means one-to-one comparison with the template) and identification (life cycle monitoring, which means a one-to-many comparison, when after the "capture" of technometric data, a database connection is established to define the object). It has shown on practice that the measurements of s-parameters allow identifying the chip and simultaneously solving the problem of identification and definition of authentic chips.
Keywords
 counterfeiting, identification of integrated circuits, physically uncloneable functions, biometrics.
Library reference
 Semenov A.V., Starcev V.N., Stepanov E.N. Technometric Identification of Integrated Circuits for Controlling Life Cycle and Counterfeit Detection // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2018. Issue 4. P. 143-148. doi:10.31114/2078-7707-2018-4-143-148
URL of paper
 http://www.mes-conference.ru/data/year2018/pdf/D072.pdf

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