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Investigation of the influence dispersion of technological parameters of VLSI on resistance to TID effects by device-technological simulation |
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Authors |
| Seletskiy A.V. |
| Shelepin N.A. |
| Smolin A.A. |
| Ulanova A.V. |
Date of publication |
| 2016 |
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Abstract |
| This paper explores the problem of radiation resistance variation to the TID effects related to the dispersion of technological parameters. With the device-technological modeling was simulated the process flow of a typical CMOS manufacturing technology with 0.18 micron technology standards, anadromous CVC of NMOS transistors and radiation leakage arising due to the impact of TID effects.
Analysis of the results showed a strong dependence of the level of absorbed dose of radiation required for the formation of radiation-induced leakage currents from technological dispersion. The difference between the maximum and minimum threshold dose formation of radiation-induced leakage exceeds 50%.
The reason for such results is a variations of concentration of the impurities in the P-well at STI/silicon interface, caused by not optimal (from the point of view of the radiation resistance) implantation regimes. In this connection, the concentration variations were about 67.14%.
This work shows the possibility of finding critical (from the point of view of the resistance to TID's leakages), the technological operations of manufacture of CMOS VLSI, by device-technological simulation. This is useful for the development of control mechanism the resistance to the absorbed dose of radiation and development RHBD technologies. |
Keywords |
| CMOS, technological dispersion, radiation hardening, TID. |
Library reference |
| Seletskiy A.V., Shelepin N.A., Smolin A.A., Ulanova A.V. Investigation of the influence dispersion of technological parameters of VLSI on resistance to TID effects by device-technological simulation // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2016. Proceedings / edited by A. Stempkovsky, Moscow, IPPM RAS, 2016. Part 4. P. 178-183. |
URL of paper |
| http://www.mes-conference.ru/data/year2016/pdf/D121.pdf |
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