| Method of placement blocks of three dimensional integration IC |
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| Authors |
| | Kulakov A.A. |
| | Kurejchik V.M. |
| Date of publication |
| | 2014 |
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| Abstract |
| | The paper describes the approach to the floorplanning problem in three-dimensional through-silicon vias integrated circuits with the heat distribution optimization. Formulation and the objective function of the floorplanning optimization problem are described. Proposed the algorithm based on combination of genetic algorithm and simulated annealing approach, considering elements’ mutual thermal effect by scheme thermal modeling. Complex thermal model calculates the temperature in the steady numerical method of finite differences. A simplified model calculates the approximate thermal evaluation.The description of developed software product andits architecture are given. The experimental results and conclusions on the applicability are shown |
| Keywords |
| | three-dimensional integrated circuits, floorplanning, heat dissipation, simulated annealing, genetic algorithms. |
| Library reference |
| | Kulakov A.A., Kurejchik V.M. Method of placement blocks of three dimensional integration IC // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2014. Proceedings / edited by A. Stempkovsky, Moscow, IPPM RAS, 2014. Part 1. P. 167-170. |
| URL of paper |
| | http://www.mes-conference.ru/data/year2014/pdf/D183.pdf |
