| Flip Chip package design for sophisticated ASIC under small lot production |
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| Authors |
| | Bychkov I.N. |
| Date of publication |
| | 2012 |
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| Abstract |
| | This paper introduces specialties of package design for perspective microprocessors under small lot production less than five thousand items. Aggregate design problems and methods of solution are unique. Applied Flip Chip technology defines chip reliability levels. Package design is realized via FCPacker in-house CAD tools. |
| Keywords |
| | Flip Chip package, die periphery I/O, FCPacker CAD tools |
| Library reference |
| | Bychkov I.N. Flip Chip package design for sophisticated ASIC under small lot production // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2012. Proceedings / edited by A. Stempkovsky, Moscow, IPPM RAS, 2012. P. 267-272. |
| URL of paper |
| | http://www.mes-conference.ru/data/year2012/pdf/D164.pdf |
