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Methods of power delivery system noise immunity improvement in system on chip “Elbrus-S”
Authors
	Vorobushkov V.V.
	Ryabtsev Yu.S.
Date of publication
	2010
Abstract
	This paper describes methods of decrementing noise in power delivery system in respect of structure microprocessor's die, substrate, PCB by mounting decoupling capacitors above the microprocessor's package. Considered applying this method in microprocessor (system on chip) "Elbrus-S", which will be produced in the beginning of 2010. In respect of considering topology mounting of on-package decoupling capacitors should significantly decrement the power noise amplitude.
Keywords
	Elbrus-S, decoupling capacitor, flip-chip, power integrity, substrate
Library reference
	Vorobushkov V.V., Ryabtsev Yu.S. Methods of power delivery system noise immunity improvement in system on chip “Elbrus-S” // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2010. Proceedings / edited by A. Stempkovsky, Moscow, IPPM RAS, 2010. P. 326-331.
URL of paper
	http://www.mes-conference.ru/data/year2010/papers/m10-241-40001.pdf