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| Modeling Technique of QFN Packages |
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| Authors |
| | Stepanov V.I. |
| | Metel A.A. |
| | Salnikov A.S. |
| | Dobush I.M. |
| | Kalentyev A.A. |
| Date of publication |
| | 2022 |
| DOI |
| | 10.31114/2078-7707-2022-3-74-81 |
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| Abstract |
| | The purpose of this work is to derive a QFN packages modeling technique using three-dimensional electromagnetic analysis.
Methods: package Electromagnetic analysis, the design of microwave monolithic integrated circuit (MMIC) using package model.
Results. The following setting combination allow us reduce time consuming to build an accurate three-dimensional package model: simulation frequency range was selected from 0.1 GHz to 20 GHz, adaptive frequency plan was used, target mesh size was used to define mesh grid, the external ports were selected as differential and were located on the printed circuit board (PCB) transmission line side, define internal ports as waveguide, the die attach paddle for the MMIC in the package is considered to be the grounding plane, the lower calculation area boundary was defined as a perfect conductor, and the other boundaries were defined as a perfect transmission material, all round holes have been replaced with octagons, for matrices solving was used iterative method. As a result, obtained table-based model for QFN package with 3x3mm2 total area used in the MMIC design. Measurement results of the MMIC balancing transformer used to verify suggested technique in the frequency range of 2-7 GHz.
Discussion. The developed QFN packages modeling technique can be used in the design of MMIC with package effect. |
| Keywords |
| | Ceramic packages, QFN, MMIC, electromagnetic analysis, equivalent circuits, modeling technique. |
| Library reference |
| | Stepanov V.I., Metel A.A., Salnikov A.S., Dobush I.M., Kalentyev A.A. Modeling Technique of QFN Packages // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2022. Issue 3. P. 74-81. doi:10.31114/2078-7707-2022-3-74-81 |
| URL of paper |
| | http://www.mes-conference.ru/data/year2022/pdf/D043.pdf |
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